Copper, bis[1,1,2,2-tetrafluoro-6,6-dimethyl-1-(trifluoromethoxy)-3,5-heptanedionato 双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II)
CAS 80289-21-0 MFCD00156516
化学结构图
SMILES:
化学属性
| Mol. Formula | Cu(C10H10F7O2)2 |
|---|---|
| Mol. Weight | 654 |
| Melting Point | 59-61 °C(lit.) |
| Danger-Level | |
| pH | : |
| Redox |
别名和识别编码
| Chemical Name | Copper, bis[1,1,2,2-tetrafluoro-6,6-dimethyl-1-(trifluoromethoxy)-3,5-heptanedionato |
|---|---|
| Synonym | Cu(FOD)2 (6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II) 双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜 (6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II) Cu(FOD)2 |
| MDL Number | MFCD00156516 |
| PubChem Substance ID | 24878556 |
| CAS Number | 80289-21-0 |
| Chemical Name Translation | 双(6,6,7,7,8,8,8,-七氟-2,2-二甲基-3,5-辛二酮酸)铜(II) |
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分类
- {SA} CVD and ALD Precursors by Metal, Copper, Materials Science, Micro/NanoElectronics, Vapor Deposition Precursors
- {SNA} CVD and ALD Precursors by Metal, Copper, Micro/NanoElectronics, Vapor Deposition Precursors, 材料科学
- {SNA} CVD and ALD Precursors by Metal, Copper, Materials Science, Micro/NanoElectronics, Vapor Deposition Precursors
